SN100C Bar Solder gives bridge-free wave soldering at temperatures normally used with tin/lead alloys. Special features include high fluidity, low copper erosion, low drossing, superior wetting, freedom from shrinkage defects and offers great solderability for printed circuit board surfaces.
Material Safety Data Sheets (MSDS)
SN100C LF Bar Solder MSDS| Alloy | Copper 1 mg/mm3 Tin 2 mg/m3 |
| Size | 25 Lbs Box |
| Applications | Wave Soldering, Manual Rework, Dip Soldering, Reflow Soldering Reactive to Equipment is LOW |
| Easy to maintain alloy composition Smooth, Bright Fillets Lower Drossing than other lead free alloys | |
| Smooth, Bright Fillets | |
| Lower Drossing than other lead free alloys | |
| Reactive to Equipment is LOW | |
