Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering.
This unique shuffle system enables a higher throughput than standard batch ovens. Both sides of the SMT reflow oven have a cooling station. While one printed circuit board is being processed, another circuit board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.
| Heating Zones | 1 |
| CyclonicsTM (Forced Air) | 1 |
| Conveyor Extensions | Dual board shuttle |
| Electrical Power | 15A @220 VAC, 50/60 Hz
1Ø, 2.7 Kw |
| Max. Board Width | 12” x 12” (305 x305mm) |
| Max. Board Height | 1.250” (32mm) |
| Cooling Station(s) | 2 |
| Max. Temperature: | GF-B-HT: 600°F (315°C) |
| Venting | 4” flange with integral fan |
| Heating Technology | Forced air convection |
| Heat Tunnel Length | NA |
| Nitrogen Option | Yes |
| Stand Option | Yes |
| PC Interface Option | No |
| Overall Dimensions | 38.13” x 28.13” x 14.5”H
968 x 715 x 368 mm |
| Approximate Weight | 102 lbs (46 kg) |
