Each mini squeegee kit contains 1 squeegee blade positive grip handle and the following stainless steel squeegee blades: SQBLADE060, 15.2mm/.6" width Qty 2 SQBLADE080, 20.3mm/.8" width Qty 2 SQBLADE100, 25.4mm/1.0" width Qty 2

Each mini squeegee kit contains 1 squeegee blade positive grip handle and the following stainless steel squeegee blades: SQBLADE070, 17.8mm/.7" width Qty 2 SQBLADE090, 22.9mm/.9" width Qty 2 SQBLADE110, 27.9mm/1.1" width Qty 2

Each mini squegee kit contains 1 squeegee blade positive grip handle and the following stainless steel squeegee blades: SQBLADE080, 20.3mm/.8" width Qty 2 SQBLADE100, 25.4mm/1.0" width Qty 2 SQBLADE120, 30.5mm/1.2" width Qty 2

Each mini squegee kit contains 1 squeegee blade positive grip handle and the following stainless steel squeegee blades: SQBLADE090, 22.9mm/.9" width Qty 2 SQBLADE110, 27.9mm/1.1" width Qty 2 SQBLADE130, 33.0mm/1.3" width Qty 2

Each mini squegee kit contains 1 squeegee blade positive grip handle and the following stainless steel squeegee blades: SQBLADE100, 25.4mm/1.0" width Qty 2 SQBLADE120, 30.5mm/1.2" width Qty 2 SQBLADE140, 35.6mm/1.4" width Qty 2

The Hakko FM-204 is a high performance desoldering station with a self contained vacuum pump that can also be used as a high performance soldering station when used with the FM-2027 connector. The FM-204 was specifically designed for desoldering lead-free solders with prototype printed cirtuit boards.

• Temperature range: 200 - 450°C (400 - 840°F)
• Built in vacuum pump
• Temperature accuracy ±15°C

These are very low cost SMT Stencils specifically designed to manually print solder paste onto printed circuit boards.

• Eliminates tedious hand soldering of prototype circuit boards
• Lower cost than stainless steel stencils
• Cut with a UV laser for optimal performance

An alternative to Electroform Stencil, UltraSlic™.
UltraSlic™ FG outperforms all other existing stencil technologies on the market today, and it can be shipped in 48 hours turnaround times.

• Fine Grain stainless steel with superior fatigue strength, super smooth surface and elevated wear factor
• Superior paste release below surface area ratios of 0.5
• Higher performance and lower cost compared to electroform, the option of step stencils

UltraSlic™ Frameless Stencils provide superior aperture registration, higher performance and lower cost compared to electroform, the option of step stencils, and the option of 48 hour turnaround times.

• Paste release performance comparable to electroform technology
• Lower standard deviations, higher repeatability and cleaner release of solder paste
• Reduces storage space requirements
• Significantly less expensive than UltraSlic™ Framed Stencils

These Multi-level Stencils offer superior flexibility in achieving the right solder paste volume deposit for components with diverse paste requirement.

• Provide optimum solder paste volume control
• Eliminate co-planarity problems
• Foils are permanently mounted into aluminum frames

The CPF Clamp works only with the CPF stencil. It works by holding the stencil in place while the solder paste is being applied.