Spray Fluxer

Spray Fluxer

Stand

Stand

Nitro-Flo Plus bar solder goes through a manufacturing process that yields a bar that will produce the lowest dross levels during soldering operations which is ideal for the printed circuit board process.

• Alloy Pure 63/37 Tin/Lead
• Low Dross Level
• Melting Point: 177°C/350°F
• Available in 50 Lb box

1 cartridge adapter 5ccm, 2cartridges 5ccm with caps and plungers, set of 10 dispensing and vacuum needles, 2 vacuum caps.

Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).

• The smooth trapezoidal sidewalls of an electroformed stencil allow for better paste release
• Nickel has a lower coefficient of friction compared to stainless steel
• Electroform foils are harder than full hard stainless steel of comparable thickness, providing for longer stencil life

Electroformed Frameless Stencils are nickel-based, electroform foils designed to work with stencil tensioning systems also known as Reusable Stencil Frames. They do not need to be permanently glued in a frame. Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on prototype printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).

Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc.

• Great for QFN’s where the pads on the board are larger than the pads on the component.
• All Flip Up stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
• All Flip Up stencils are custom made to order per your specification.

CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.

• A CPF stencil makes for simple alignment when pasting, and serves as an excellent tool for applying paste when boards are highly populated.
• All CPF stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
• All CPF stencils are custom made to order per your specification.

* Order contain stencil only. Please see accesories

SH-1 Handheld printing tool for use with Flip-Up Stencils

The MM-1 Mini Mirror allows the user to inspect solder joints of a BGA component before and after the reflow at the BGA rework process. The operator will be able to visually inspect the outer row of solder joints to determine proper wetting, and alignment. The MM-1 Mini Mirror is a great tool for PCB rework and prototype printed circuit board assembly.