Component Print Frame (CPF) are BGA Rework Stencils designed to ensure accurate solder paste deposition onto the balls of the BGA. Because the CPF prints solder paste onto the BGA, there are no keep out or clearance issues with adjacent components on the printed circuit board.
They come with a squeegee blade. CMF is a great tool for PCB rework and printed circuit board assembly.
Technology Used to Make the Stencils | Laser cut or chem etch |
Material Used | Stainless Steel |
Stencil Thickness | .004 - .012 inches |
Minimum Cut Width | .002 inches |
Aperture Tolerance | within .00025 inches |