Nitrogen inerting option (GF-12-N).

Nitrogen inerting option for GF-120 Series (model GF-120-N).

Status light tower option for GF-120 (model GF-SLT).

Nitrogen inerting option (GF-B-N).

Stand Cabinet (GF-B-ST).

Stand Cabinet (GF-12-ST).

Stand Cabinet for GF-120 (Model GF-120-ST).

StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.

• StencilQuik comes in a pack of 10 BGA rework stencils
• Allows you to replace your own BGAs or CSPs without special training or large capital equipment expenditures
• Acts as an insulating barrier between solder balls as the solder paste masks adjacent apertures increasing placement reliability
• Simplifies BGA placement as you can "feel" the device settle into the apertures of the StencilQuik™

POWER CORE NC601 wire solder is a RA activated no-clean for repairing through-hole, mixed and surface mount assemblies. The flux core provides faster and better fluxing activity than RA flux cores. NC601 flux is formulated to provide clear, colorless residues, maximum activity and high reliability without cleaning in most situations.

POWER CORE WS101 wire solder is a high activated water washable for repairing through-hole, mixed and surface mount assemblies. The flux core provides faster and better fluxing activity than RA flux cores. WS101 flux is formulated to provide high activity soldering, leaving an easily washable residue in plain water without the need for cleaning additives.

POWER CORE SN100C NC601 wire solder is a RA activated no-clean for repairing through-hole, mixed and surface mount assemblies. The flux core provides faster and better fluxing activity than RA flux cores. NC601 flux is formulated to provide clear, colorless residues, maximum activity and high reliability without cleaning in most situations.

Nihon Superior SN100C WS101 wire solder is a high activity water washable solder for repairing through-hole, mixed and surface mount assemblies. The flux core provides faster and better fluxing activity than RA flux cores. WS101 flux is formulated to provide high activity soldering, leaving an easily washable residue in plain water without the need for cleaning additives.