Indium8.9, SAC305 Pb-Free, Type 4, 88.25% Solder Paste

Indium8.9, SAC305 Pb-Free, Type 4, 88.25% Solder Paste

Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace Pb-bearing solders.

Offers excellent stencil print transfer efficiency to work in the broadest range of processes. In addition, the superior soldering performance under high- temperature and long reflow processes provides exceptional head-in-pillow performance.
Packaging
Product Pricing
Quantity:
Unit Price:
$120.00
Total: $120.00

Main Features

Indium8.9 Excellent wetting to all common finishes
  • High transfer efficiency through small apertures (≤0.66 AR)
  • Excellent wetting to all common finishes at high and low peak reflow temperatures
  • Eliminates head-in-pillow defects
  • High oxidation resistance

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Type 3 and Type 4 powder are standard offerings with SAC alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed below.

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste. Solder paste packaged in cartridges should be stored tip down.

Storage Conditions(unopened containers) <10°C
Shelf Life 6 months

Printing

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:

  • Discrete components—A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
  • Fine-pitch components—A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5–15% is common).
  • For optimum transfer efficiency and release of the solder paste from the stencil apertures, industry standard aperture and aspect ratios should be adhered to.

Recommended Printer Operation

Solder Paste Bead Size ~20–25mm in diameter
Print Speed 25–100mm/second
Underside Stencil Wipe Start at once per every 5 prints and decrease frequency until optimum value is reached Underside Stencil Wipe
Squeegee Type/Angle Metal with appropriate length; 45 or 60° squeegees are typically used Squeegee Type/Angle
Separation Speed 5–20mm/second or per equipment manufacturer’s specifications Separation Speed
Solder Paste Stencil Life Up to 8 hours (at 30–60% RH and 22–28°C)
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