StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.
- StencilQuik comes in a pack of 10 BGA rework stencils
- Allows you to replace your own BGAs or CSPs without special training or large capital equipment expenditures
- Acts as an insulating barrier between solder balls as the solder paste masks adjacent apertures increasing placement reliability
- Simplifies BGA placement as you can "feel" the device settle into the apertures of the StencilQuik™
$124.50
Lead Time: 5 to 7 business days
These laser cut stencils are typically used to manually print a single component on a printed circuit board.
- Maximum Size 2" x 2"
- Available with or without flaps (Flaps facilitate handling)
- Mainly used for PCB rework but can used for prototype PCB assembly of simple boards
$80.00
Lead Time: 24-Hour Turn
Were designed to reliably and quickly replace leadless device packages such as QFNs or LGA packages.
- StencilMate™ comes in a pack of 20 rework stencils
- Alignment is simple. No need to use custom fixtures or frames.
- The stencil is cut using a laser to your exacting device requirements.
- Eliminate the need to use capital intensive equipment or require a high degree of skill.
$114.50
Lead Time: 5 to 7 business days
StikNPeel™ greatly simplifies the ability to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel™ onto the PCB and apply the paste.
- StikNPeel comes in a pack of 10 stencils
- This rework process overcomes many of the headaches of using metal stencils
- Eliminates "smearing" of solder paste underneath the stencil
- Co planarity between board and stencil is assured due to the adhesive backing on the stencil
$134.50
Lead Time: 5 to 7 business days
Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc.
- Great for QFN’s where the pads on the board are larger than the pads on the component.
- All Flip Up stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
- All Flip Up stencils are custom made to order per your specification.
$110.00
Lead Time: 3-5 Days
CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.
- A CPF stencil makes for simple alignment when pasting, and serves as an excellent tool for applying paste when boards are highly populated.
- All CPF stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
- All CPF stencils are custom made to order per your specification.
* Order contain stencil only. Please see accesories
$175.00
Lead Time: 3-5 Days