StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.
These laser cut stencils are typically used to manually print a single component on a printed circuit board.
Were designed to reliably and quickly replace leadless device packages such as QFNs or LGA packages.
StikNPeel™ greatly simplifies the ability to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel™ onto the PCB and apply the paste.
Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc.
CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.
* Order contain stencil only. Please see accesories
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