These frameless SMT stencils are specifically designed to manually print solder paste onto printed circuit boards.
Our stainless steel stencils were specially designed for the Maker’s market so everyone can have access to a high quality SMT stencil at a low price.
These are very low cost SMT Stencils specifically designed to manually print solder paste onto printed circuit boards.
StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.
These laser cut stencils are typically used to manually print a single component on a printed circuit board.
Were designed to reliably and quickly replace leadless device packages such as QFNs or LGA packages.
StikNPeel™ greatly simplifies the ability to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel™ onto the PCB and apply the paste.
Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc.
These laser cut stencils are designed to work with stencil tensioning systems also known as Reusable Stencil Frames like the Wizard Frame.
CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.
* Order contain stencil only. Please see accesories
These solder paste stencils are designed for high volume screen printing on printed circuit boards.
These Multi-level Stencils offer superior flexibility in achieving the right solder paste volume deposit for components with diverse paste requirement.
An alternative to Electroform Stencil, UltraSlic™.
UltraSlic™ FG outperforms all other existing stencil technologies on the market today, and it can be shipped in 48 hours turnaround times.
Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).