NC-SMQ92J Sn63/Pb37, Type 4, 89.5% Solder Paste

NC-SMQ92J Sn63/Pb37, Type 4, 89.5% Solder Paste

NC-SMQ92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting.

NC-SMQ92J will perform well on high-speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications, and Bellcore test criteria.
Packaging
Product Pricing
Quantity:
Unit Price:
$80.00
Total: $80.00

Main Features

NC-SMQ92J Excellent wetting reflow in air
  • Excellent wetting reflow in air
  • Probe-testable residue
  • Extended open time
  • Consistent fine-pitch printing
  • Strong initial tack strength and long-term stability
  • High humidity resistance
  • Halogen-free

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of SnPb and SnPbAg in the industry standard Type 3 mesh size. Other non-standard mesh sizes are available upon request. The weight ratio of the flux/vehicle to the solder powder is referred to as the metal load and is typically in the range of 85–92% for standard alloy compositions.

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste. Solder paste packaged in cartridges should be stored tip down.

Storage Conditions(unopened containers) <10°C
Shelf Life 6 months

Printing

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:

  • Discrete components—A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
  • Fine-pitch components—A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5–15% is common).
  • For adequate release of solder paste from stencil apertures, a minimum aspect ratio of 1:5 is suggested. The aspect ratio is defined as the width of the aperture divided by the thickness of the stencil.

Recommended Printer Operation

Solder Paste Bead Size ~20–25mm in diameter
Print Speed 25–100mm/second
Squeegee Pressure 0.018–0.027Kg/mm of blade length
Underside Stencil Wipe Start at once per every 10–25 prints and decrease frequency until optimum value is reached
Squeegee Type/Angle Metal with appropriate length/~45–60 degrees
Separation Speed 5–20mm/second or per equipment manufacturer’s specifications
Solder Paste Stencil Life >12 hours (at 30–60% RH and 22–28°C)
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