|Recommended Initial Printer Settings - Dependent on PCB and Pad Design|
|Parameter||Recommended Initial Settings|
|Squeegee Pressure||0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade|
|Squeegee Speed||12-150 mm/sec (.5-6”/sec)|
|Snap-off Distance||On Contact 0.00 mm|
|PCB Separation Distance||0.75 - 2.0 mm|
|PCB Separation Speed||Slow|
Pre-Reflow: AIM DJAW-10 effectively removes WS488 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW10 will not dry WS488 and will enhance transfer properties. Do not over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse.
Post-Reflow Flux Residue: WS488 residues can remain on the assembly after reflow for up to 2 weeks without corrosion. Cleaning is mandated and can be performed in plain water following with a final rinse in DI water.
Please refer to datasheets.
|Refrigerated Shelf Life||6 Months||0°C-12°C (32°F-55°F)|
|Appearance||Gray, Smooth, Creamy|
|Melting Point||217° C|
|Particle Size||T3, T4, T5|
|Metal Loading||88.5% (T3)|
|Packaging||Available in all industry standard packaging.|